To ensure the quality of production, all manufacturing products are to be examined using several approaches:

(1) Film Inspection
* The visual inspection should be carried out after film development. 
* The main items to be inspected include: the open and short circuits, trace thinness, symmetries, and scratches. 
* The films must be protected in a plastic bag after inspection.

(2) Development of Inner Surface Inspection (double-sided boards are excluded)
* PCB to be examined after the exposure of the inner layer production.
* The main items to be inspected include: open and short circuits, foreign inclusions, symmetries, and scratches.
 
(3) After-etched of Inner Surface Inspection (double-sided boards are excluded)
* PCB to be examined after the exposure of the inner layer production.
The main items to be inspected include: open and short circuits, scratches, discolouration, bulges, foreign inclusions, peeling, copper residues, and cuts.
 
(4) Copper Plating Inspection
* Copper plating prior to Inspection.
* The main items to be inspected include: the plating explosion and block holes.
 
(5) Development of Outer Surface Inspection
* PCB to be examined after the exposure of the outer layer production.
* The main items to be inspected include: open and short circuits, foreign inclusions, symmetries, and scratches.
 
(6) After-etched of Inner Surface Inspection
* PCB to be examined after the exposure of the outer layer production.
* The main items to be inspected include: open and short circuits, scratches, discolouration, bulges, foreign inclusions, peeling, copper residues, and cuts.

(7) Final Inspection (For more information, please refer to Dr. JetPCB/ Introduction to PCB Fabrication)
* Final visual inspection.
* Packing products in accordance with part numbers.