Technical Support

How do the following perform during PCB manufacturing production: tin lead, tin-nickel-copper (Sn-Ni-Cu) and tin-silver-copper (Sn-Ag-Cu)?

List Tin lead Tin-nickel-copper  Tin-silver-copper
Smooth Shiny Finish Good Good Weak
Etched Quantity of Copper Low Middle High
Cost Very low Low Slightly high
Eutectic Growth Slow Depressed Accelerated
Manufacturing Operations Easy Easy Hard
Maintenance Easy Easy Hard
Melting Point Low (183℃) High (227℃) High (217℃)
Wetting Ability 0.1sec (230℃) 0.8sec (270℃) 0.48sec (270℃)